Thermally conductive materials ensure targeted heat dissipation, protection of sensitive components and optimum system performance. SPÄH offers solutions ranging from gap pads and silicone or ceramic-filled materials to nano and hybrid pads.
Typical applications: Heat dissipation between chips and heat sinks, thermal insulation, protection of sensitive components
Sectors of application: Electronics, automotive, medical technology, LED technology, industrial systems
Advantages at a glance:
High thermal conductivity
Flexible adaptation to uneven surfaces
Wide range of materials: Silicone, ceramic, nano and hybrid pads
Simple processing and customized cuts
Optimum performance for demanding applications
Heat conducting materials from SPÄH – intelligent solutions for maximum efficiency.
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